New Delhi/Bhubaneswar, May 29: The Odisha government signed a memorandum of understanding (MoU) with Intel and 3D Glass Solutions (3DGS) to bring advanced substrate manufacturing technology to India, officials said on Friday.

Congratulating the state government and its partners, Union Minister for Electronics and Information Technology Ashwini Vaishnaw said the pact would further strengthen India’s semiconductor ecosystem.

“Congratulations to the Govt. of Odisha, Intel and 3DGS on signing an MoU to bring substrate manufacturing technology to India. This will further advance the semiconductor ecosystem in India,” he posted on X.

Congratulations to the Govt. of Odisha, Intel and 3DGS on signing an MoU to bring substrate manufacturing technology to India.

This will further advance semiconductor ecosystem in India. pic.twitter.com/elxs6r8muN

— Ashwini Vaishnaw (@AshwiniVaishnaw) May 29, 2026

The agreement builds on Odisha’s broader semiconductor push announced earlier this year. In April, the foundation stone was laid for India’s first advanced 3D chip packaging unit at Info Valley in Bhubaneswar under the Heterogeneous Integration Packaging Solutions project promoted by 3DGS.

The project involves an investment of nearly Rs2,000 crore and is expected to manufacture around 70,000 glass panels annually, along with 50 million assembled units and nearly 13,000 advanced 3D heterogeneous integration (3DHI) modules, according to government estimates.

Union Minister Vaishnaw earlier noted that under Prime Minister Narendra Modi’s leadership, India’s semiconductor sector is witnessing rapid growth, with Odisha emerging as a key contributor.

Chief Minister Mohan Charan Majhi also highlighted that Odisha is the only state where both India’s first compound semiconductor fabrication unit and first 3D glass substrate packaging facility are being established.

Also Read: Odisha Emerging As Semiconductor Hub, Says CM Majhi At 3D Glass Unit Groundbreaking

The development comes as the Centre continues to strengthen the domestic semiconductor ecosystem through policy support and incentives under the Semicon India Programme. Earlier this week, the government announced that 12 fab or packaging projects and 24 semiconductor design projects have already been approved. Additionally, an online Investor Support portal has been launched to boost investor confidence and address industry concerns.

With Odisha’s latest pact, India takes another step toward building a robust semiconductor supply chain, positioning itself as a global hub for advanced electronics manufacturing.